Akasa T5 Essential Thermal Paste 5G

10.30

T5 Essential Thermal Compound Easily apply hi-performance thermal paste to your CPU and GPU, developed for higher thermal conductivity. Perfect for standard systems with 10-20 applications. Low Thermal Resistance for Hi-Heat Transfer Heat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler. Easy and Safe Application Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components. Conveniently Included Wipes and Spreader Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink. Features • Thermal Conductivity: 4.0 W/mK. • Specific Gravity: 2.6. • Form: Non-curing compound. • Operating Temperature: -50°C to 220°C. • Thermal Resistance: 0.07°C-cm²/W @ 60 psi. • Colour: Grey. • Viscosity: 4,800,000 (mPa.s/ 22°C). • Weight: 5g.

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T5 Essential Thermal Compound Easily apply hi-performance thermal paste to your CPU and GPU, developed for higher thermal conductivity. Perfect for standard systems with 10-20 applications. Low Thermal Resistance for Hi-Heat Transfer Heat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler. Easy and Safe Application Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components. Conveniently Included Wipes and Spreader Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink. Features • Thermal Conductivity: 4.0 W/mK. • Specific Gravity: 2.6. • Form: Non-curing compound. • Operating Temperature: -50°C to 220°C. • Thermal Resistance: 0.07°C-cm²/W @ 60 psi. • Colour: Grey. • Viscosity: 4,800,000 (mPa.s/ 22°C). • Weight: 5g.

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